ASML, TSMC Sign Pact to Develop Larger-Format Photomasks
By Aimee Look
ASML Holding struck a deal with Taiwan Semiconductor Manufacturing Company to develop larger-format photomasks used in chipmaking.
The semiconductor giants said they signed an agreement to develop 12-inch masks and lead the industry's transition toward larger Extreme Ultraviolet lithography photomasks.
The development is expected to lower chipmaking costs, improve productivity and remove stitching constraints, the companies said.
The initiative is targeting the development of a pilot line for the 12-inch masks by 2031, with full readiness for production of advanced nodes by 2033.
Write to Aimee Look at aimee.look@wsj.com
(END) Dow Jones Newswires
September 08, 2026 02:54 ET (06:54 GMT)
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